Electrostatic protection product chip laminating device

• Main Authors: WEN GUOHAO, HUANG ZHENGXIN, ZHONG JINMIN
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses an electrostatic protection product chip laminating device, including chip and blue membrane, be equipped with the conductive patch film between chip and the blue membrane, blue membrane below is equipped with and is used for the chip thimble of jack -up up, chip top is equipped with and is used for the vacuum slot up inhaled the chip, the vacuum slot is pasted on the lead frame after having inhaled the chip of the attached conductive patch of having film. The utility model discloses after using the conductive patch film, can leave out gumming technology, directly carry out the chip laminating, improved in the chip laminating technology regular unusual, the volume of gluing too much with the volume of glue situation too little, shortened the time that the electrostatic protection original paper was makeed. The utility model discloses simple structure, convenient to use has improved work efficiency greatly, has reduced the manufacturing cost of enterprise. 本实用新型公开了种静电保护产品芯片贴合装置，包括芯片