Highly reliable surface mounting's diode

• Main Authors: WANG AIMIN, MA JIE, ZHANG BAOCAI, CHI YIMING, LI DONGHUA
• Format: Patent
• Language: Chinese; English
• Published: 31.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a highly reliable surface mounting's diode, this diode device uses metal -ceramic package, the chip passes through the sintering zone that the solder sintering was fixed at the shell, the bonding wire for the mode that adopts ultrasonic bonding is the bonding region of chip with the bonding region of shell is continuous and parallel seam welding is sealed, original plastic package device has been overcome because of the limited problem that can not be used for highly reliable device field of operational environment, it is that the circuit board is not done and is realized that the normal position substitutes under the circumstances of change not changing the pad size that this surface mounting diode makes original circuit, and the reliability obtains improving, processing technology is simpler in production, which is convenient for mass production. 本实用新型公开了种高可靠表面贴装的二极管，该二极管器件使用金属陶瓷外壳、芯片通过焊料烧结固定在外壳的烧结区、采用超声键合的方式用键合丝把芯片的键合区与外壳的键合区相连以及平行缝焊密封，克服了原有塑料封装器件因工作环境受限不能用于高可靠器件领域的问题，该表面贴装二极管使原