Composite circuit board

The utility model discloses a composite circuit board, including base plate layer A, base plate layer A's surface is provided with circuit region and inverter circuit district, and inverter circuit district surface covering has a ceramic tectorial membrane, the surface covering of circuit regio...

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Bibliographic Details
Main Authors DAI CHUNPING, LIU CHANGTAO, PAN HAI, LAI ZHIHUA, XIE JIAOLI, LUO CHUAN, LING WEIWEI
Format Patent
LanguageChinese
English
Published 10.05.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a composite circuit board, including base plate layer A, base plate layer A's surface is provided with circuit region and inverter circuit district, and inverter circuit district surface covering has a ceramic tectorial membrane, the surface covering of circuit region has one deck ether ketone type heat to mould polyimide film, and the ether ketone type heat fixed surface that moulds polyimide film installs the conductive metal layer, the top on conductive metal layer covers there is one deck benzoxazoles polyimide film, and benzoxazoles polyimide film's fixed mounting all around has the shielding net. This composite circuit board has combined two kinds of polyimide's advantage, and adhesion properties has been guaranteed in the introduction of ether ketone key, and flexibility has improved processing property, and high temperature resistance has been guaranteed in benzoxazoles's introduction, dimensional stability, and low hygroscopicity, two kinds of polyimide have very low diele
Bibliography:Application Number: CN20162988927U