Recirculation system for treating used etching liquid

• Main Authors: LI JUN, MAO ANZHANG, YAO BIAO
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2017
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

The utility model relates to a recirculation system for treating used etching liquid, it includes: regenerating unit, regenerating unit has the etching and resumes the groove for receive and used the etching solution, and electrochemistry unit for provide the reactant extremely the etching resumes the groove, the reactant with used the etching solution reaction in order to resume used oxido reduction potential and/or the density of etching solution and regenerated for usable etching solution. 本实用新型涉及种用于处理已使用蚀刻液的再循环系统，其包括：再生单元，所述再生单元具有蚀刻恢复槽，用于接收已使用蚀刻液；以及电化学单元，用于提供反应物至所述蚀刻恢复槽，所述反应物与所述已使用蚀刻液反应以恢复所述已使用蚀刻液的氧化还原电位和/或密度而再生为可使用的蚀刻液。