Encapsulation depth of parallelism adjustment mechanism

• Main Authors: LI HONGJING, XIE ZHUXIN
• Format: Patent
• Language: Chinese; English
• Published: 07.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

The utility model discloses an encapsulation depth of parallelism adjustment mechanism, including relative upper cover subassembly and the low head subassembly that sets up, the upper cover subassembly includes and comprises the thermal -insulated piece of the last connection fixing base that down sets gradually, upper cover regulating plate, the first heat insulation of upper cover, upper cover second, upper cover heat insulating board and upper cover, the positive and negative of connecting the fixing base all is equipped with a plurality of screw hole and through -hole, the spiro union has the taut screw of head on the screw hole, wears to be equipped with the tight screw in head top in on the through -hole to both ends at this upper cover encapsulation auxiliary block are equipped with the buffer unit, the low head subassembly includes and comprises the last low head that down sets gradually, low head heat insulating board, low head heat insulation and regulating bottom. Its reasonable in design, the tens