High yield pastes dress rectifying device

The utility model relates to a high yield pastes dress rectifying device, including first lead wire strip, second lead wire strip, connection piece and the diode chip that is located the epoxy packaging body, the second go between an one end be with the weld zone that the first welding ends of conne...

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Bibliographic Details
Main Authors CAO CHUNMING, CAO SHIZHONG
Format Patent
LanguageChinese
English
Published 28.09.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model relates to a high yield pastes dress rectifying device, including first lead wire strip, second lead wire strip, connection piece and the diode chip that is located the epoxy packaging body, the second go between an one end be with the weld zone that the first welding ends of connection piece is connected, the conduct is distinguished for pin district, the pin of this second lead wire strip to this second lead wire strip other end the current transmission end of rectifier, connection piece second welding ends passes through the solder paste electricity with the diode chip other end and is connected, the second welding ends of connection piece is the wave surface compriseed a plurality of wave surface and trough surface NULL, and this wave surface is through solder paste layer and diode chip electric connection, the wave surface end of connection piece is located directly over the U -shaped recess. The utility model discloses high yield pastes dress rectifying device has increased area of con
Bibliography:Application Number: CN201620293156U