Plastic envelope GBPC rectifier bridge

• Main Authors: Feng Yaning, Zhang Yiyuan
• Format: Patent
• Language: Chinese; English
• Published: 24.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a plastic envelope GBPC rectifier bridge, it includes the rectifier stack, the rectifier stack includes that lead frame, four back welding are in rectifier diode chip and four lead wire wire jumpers on the lead frame, the rectifier diode chip with the lead frame passes through lead wire jumper connection forms closed rectifying circuit, and epoxy plastic -sealed body, the compression moulding of epoxy plastic -sealed body wrap up in the rectifier diode chip the lead frame with the lead wire wire jumper is peripheral. The utility model discloses an epoxy material plastic -sealed body of compression moulding will the lead frame the rectifier diode chip with lead wire wire jumper parcel is sealed, plays better guard action, plastic envelope GBPC rectifier bridge's heat dispersion and sealing performance are effectively improved, and then make reliability and stability obtain optimizing. 本实用新型公开了种塑封GBPC整流桥，其包括整流组件，所述整流组件包括引线框架、四个背面焊接在所述引线框架上的整流二极管芯片以及四根引线跳线，所述整流二极管芯片和所述引线框架通过所述引线跳线连接形成