Ultra -thin heat conduction component and ultra -thin heat conduction component of buckling

The utility model relates to a heat conduction component field, an ultra -thin heat conduction component and ultra -thin heat conduction component of buckling for give off the heat that the heat production component produced, thin heat conduction component includes epitheca board and lower coverboar...

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Bibliographic Details
Main Author Ke Lie
Format Patent
LanguageChinese
English
Published 17.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model relates to a heat conduction component field, an ultra -thin heat conduction component and ultra -thin heat conduction component of buckling for give off the heat that the heat production component produced, thin heat conduction component includes epitheca board and lower coverboard, go up coverboard and coverboard combination down and form lamellarly, and go up coverboard and the airtight and vacuous cavity of coverboard intermediate formation down, be filled with heat -conducting fluid in the cavity, the coverboard has the heat production component position of laminating on the heat production component down, ultra -thin heat conduction component includes further that the centre gripping is in go up the capillary body in coverboard and the cavity between the coverboard down, and the internal portion of capillary is densely covered has a microcellular structure that is used for receiving heat -conducting fluid, the partly of the capillary body covers in heat production component position. O
Bibliography:Application Number: CN20162243902U