Circuit board temperature control device

• Main Author: Yu Junxing
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a circuit board temperature control device uses on the circuit board, for the chip on the circuit board adds nice and warm heat dissipation, circuit board temperature control device includes thermal pad and adds the hotting mask, thermal pad sets up in the position that chip upper surface and die piece correspond, it sets up in the position that chip upper surface and thermal pad leave mutually to add the hotting mask. Circuit board temperature control device is still including the heat dissipation lug, the laminating of heat dissipation lug thermal pad sets up, and thermal pad is located between heat dissipation lug and the chip, the heat dissipation lug passes through thermal pad dispels the heat to the produced heat of chip. The utility model discloses an it does not influence each other to add nice and warm heat dissipation, and the mutually noninterfere can fine solution heating film resistance influence the radiating problem of chip. 本实用新型公开了种电路板温度控制装置，应用在电路板上，为电路板上的芯片进行加热和散热