Novel high peel strength intensity paper base printed wiring board

• Main Author: FU ZHIXIONG
• Format: Patent
• Language: Chinese; English
• Published: 06.07.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

The utility model discloses a novel high peel strength intensity paper base printed wiring board has refill and copper foil circuit layer, this refill comprises a plurality of layers of gumming wood pulp paper and single glass fibrous layer complex, these a plurality of layers of range upon range of settings of gumming wood pulp paper, and every layer of flooding has cardanol modified phenolic resin, glass fiber layer complex is on the gumming wood pulp paper of the superiors, and copper foil circuit layer is compound on the glass fiber layer, and this copper foil circuit layer and a glass fiber layer barium phenolic resin glue film through melamine -modified urea -formaldehyde resin coheres the complex. This novel paper base printed wiring board has not only improved the heat resistance and the panel wet skid resistance of circuit board, but also has improved the peel strength and the peel strength's of circuit board homogeneity for in the production of slim copper foil paper base circuit board, better econo