Lead frame pin copper bridge type packaging structure

• Main Authors: ZHUANG WENKAI, JIN CHENG, GONG ZHEN, ZHANG HANGYU, ZHU ZHONGMING
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a lead frame pin copper bridge type packaging structure, it includes lead frame (1), lead frame (1) is including ji dao and pin, last be provided with chip (4) of ji dao, be connected through metal wire (5) between chip (4) and the pin, through the fixed copper bridge pad (2) that is provided with of second solder layer (7) on the pin of lead frame (1), copper bridge pad (2) is bridge shape structure, the copper bridge pad (4) of bridge shape is striden between the pin and pin of locating lead frame (1), fixed be provided with passive components and parts (3) are gone up through first solder layer (6) to copper bridge pad (4) upper surface. The utility model relates to a lead frame pin copper bridge type packaging structure, its simple structure, the problem of lack of fill between passive component and the chip can be avoided effectively in the simple operation to simple process, the cost is lower, can be used to multiple type frame, the un -specificness restriction.