Utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer

• Main Authors: ZHAI KE, HE QING
• Format: Patent
• Language: Chinese; English
• Published: 09.03.2016
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The utility model provides an utilize compound piezoelectric vibrator high frequency ultrasonic buffing device of matching layer, relates to the device of the compound polishing of an ultrasonic wave, the device is including piezoceramics (1), matching layer I (2), matching layer II (3), brush sliding ring (4), weight (5), polish (6), polishing pad (7), polishing work platform (8), the shaft hole of brush sliding ring (4) is passed through clearance fit and is linked together with weight (5), brush sliding ring (4) are drawn forth the well through -hole that the wire passes through weight (5) and are connected to on piezoceramics (1), paste on matching layer I (2) piezoceramics (1), II (3) water of matching layer adsorb on matching layer I (2), paste on polishing work platform (8) polishing pad (7). The device pastes the acoustic matching material at piezoelectric element radiation end, transmits the polishing interface with the ultrasonic wave efficient of high frequency, realizes the planar overall situatio