Carbide formula moulding -die head structure

The utility model relates to a carbide formula moulding -die head structure belongs to the semiconductor packaging technology field. It includes moulding -die head body, moulding -die head body is made by the carbide material, moulding -die head body head includes central pattern (1) and peripheral...

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Bibliographic Details
Main Authors ZHUANG WENKAI, GONG ZHEN, ZHANG HANGYU, ZHU ZHONGMING
Format Patent
LanguageEnglish
Published 03.02.2016
Subjects
BASIC ELECTRIC ELEMENTS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:The utility model relates to a carbide formula moulding -die head structure belongs to the semiconductor packaging technology field. It includes moulding -die head body, moulding -die head body is made by the carbide material, moulding -die head body head includes central pattern (1) and peripheral moulding -die wall (4), (1) four side in the center pattern is provided with annular (2) all around, be provided with between annular (2) and the peripheral moulding -die wall (4) all around outside annular (3), the center pattern (1), all around the surface of annular (2), outside annular (3) and peripheral moulding -die wall (4) all be provided with one deck nanometer diamond cladding material. The utility model relates to a carbide formula moulding -die head structure, it can improve the life of moulding -die head by a wide margin to improve the homogeneity of distribution of moulding -die soldering tin and thickness.
Bibliography:Application Number: CN20152644532U