Fine board during multilayer is compound
The utility model discloses a fine board during multilayer is compound, including well fine sheet layer (1), enhancement layer (2), viscose layer (3), its characterized in that: there are one to several layers enhancement layer in upper and lower between the fine sheet layer, between the enhancement...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
09.12.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a fine board during multilayer is compound, including well fine sheet layer (1), enhancement layer (2), viscose layer (3), its characterized in that: there are one to several layers enhancement layer in upper and lower between the fine sheet layer, between the enhancement layer, be equipped with the viscose layer between enhancement layer and the well fine sheet layer. The enhancement layer of saying, be by many aequilate little rectangular multiply wood (4) all around the rubber coating form horizontal adhesive linkage (6) and vertical adhesive linkage (5), width direction add have the wood in rubber band strip (7) bond and formation to piecing together. Owing to be dumped multiply wood in the construction that utilizes, make its firm combination together through rubber band strip bonding in adding the wood after handling. The fine board in compound cost is greatly reduced, and the price is lower than market like product, has reached completely the utility model discloses can reduce product cost, resources are saved, realization changing waste into valuables effectively, strong protection forest resources's invention purpose. |
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Bibliography: | Application Number: CN20152480792U |