FPC adsorbs adhesive tape changes subassembly

• Main Authors: RAO XIANHUI, TAN XIANFEI
• Format: Patent
• Language: English
• Published: 11.11.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a FPC adsorbs adhesive tape changes subassembly, including the adhesive tape bottom plate, install the micarta above the adhesive tape bottom plate, arrange the compound adhesive tape tool of inhaling of adhesive tape bottom plate upper portion in, set up the flexible printed circuit, FPC on inhaling compound adhesive tape tool, because of FPC adsorbs adhesive tape changes subassembly adopts the adhesive tape bottom plate, compound adhesive tape tool is inhaled to the micarta, and flexible printed circuit, FPC constitutes. Add man -hour, it has the adhesive tape of micarta bottom plate to utilize to adopt to paste, has the compound adhesive tape tool of inhaling of flexible printed circuit, FPC both correspond the coincidence and folding and form the commentaries on classics subsides subassembly of whole or whole piece with pasting. Avoided because of artificial factor throw off arouses the easy off normal of adhesive tape, the easy soiled phenomenon in surface takes place to improve laminating quality rate. With stick laminating mode intercomparison among the prior art, the utility model discloses can also productivity gain.