Pad structure and electronic product thereof

The utility model relates to an electronic circuit technique discloses a pad structure. The embodiment of the utility model provides a through setting up a central via hole the current pad in the middle of, with the center via hole is the center, will the pad is including 2 at least boxes cutting ap...

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Bibliographic Details
Main Author LUO YINGCHUN
Format Patent
LanguageEnglish
Published 28.10.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model relates to an electronic circuit technique discloses a pad structure. The embodiment of the utility model provides a through setting up a central via hole the current pad in the middle of, with the center via hole is the center, will the pad is including 2 at least boxes cutting apart, because the pad divide into a plurality of boxes and electronic components contact, box area of contact is little, and the radiating rate slows down, when crossing the reflow soldering soldering tin can with the pad dead contact, improve the stability of electronic product. The utility model discloses be applied to above -mentioned pad structure in the electronic product of chip, it is too big to solve in the current electronic product electronic components's pad, the heat dissipation at the excessive speed, lead to when crossing the reflow soldering soldering tin can not with the pad dead contact, cause the unstable defect of electronic product.
Bibliography:Application Number: CN20152493056U