LED packaging structure

• Main Author: SI HONGKANG
• Format: Patent
• Language: English
• Published: 26.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a LED packaging structure, including carborundum radiating basal plate, the LED luminescence chip, it has fluorescent material's encapsulation glue film to adulterate, and the fog photosphere, the fog photosphere includes the resin glue and is scattered in a plurality...