LED packaging structure

The utility model provides a LED packaging structure, including carborundum radiating basal plate, the LED luminescence chip, it has fluorescent material's encapsulation glue film to adulterate, and the fog photosphere, the fog photosphere includes the resin glue and is scattered in a plurality...

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Bibliographic Details
Main Author SI HONGKANG
Format Patent
LanguageEnglish
Published 26.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model provides a LED packaging structure, including carborundum radiating basal plate, the LED luminescence chip, it has fluorescent material's encapsulation glue film to adulterate, and the fog photosphere, the fog photosphere includes the resin glue and is scattered in a plurality of optics microballons of arranging with individual layer, procumbent mode in the resin glue, this optics microballon are including the spherical nuclei at center, the first spherical shell of these spherical nuclei of cladding, the second spherical shell of the first spherical shell of cladding, and these spherical nuclei have a minimum transmission rate, and first spherical shell has a highest transmission rate, the transmission rate of second spherical shell between spherical nuclei and first spherical nuclei, the utility model discloses can make light become soft to the light halo shape ring of light has, the utility model discloses the LED encapsulation is fit for being used for decorating.
Bibliography:Application Number: CN20142716873U