Composing of response carrier structure

• Main Authors: LI JIANSONG, AN HONGPENG, NIE XIANG
• Format: Patent
• Language: English
• Published: 19.08.2015
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHYSICS; PRINTED CIRCUITS

The utility model discloses a composing of response carrier structure, wherein, the composing structure includes: the base plate, wherein the base plate includes a plurality of induction area and around induction area's die-cut region, a plurality of response carriers of setting on the induction area of base plate, every response carrier corresponds with an induction area, and wherein the at least one end of every response carrier is provided with the pad of walking the line connection with inside, the conducting wire of setting on the die-cut region of base plate, wherein conducting wire and at least two solder connection that respond to carriers the technical scheme of the utility model through the conducting wire will be at least the solder connection of two response carriers get up, like this can so that inside in the response carrier that links to each other walk the line and have the same current potential to make on the static that produces in the processing procedure divides equally the response carrier that links to each other, thereby can reduce the voltage of the static in the response carrier, avoided inside and walk the space producing electrostatic discharge and leading to the fact its to damage, and then can improve the yields of response carrier