LED encapsulation structure
The utility model provides an LED encapsulation structure. The LED encapsulation structure includes a silicon carbide heat dissipation substrate, an LED light-emitting chip, a fluorescent material-doped encapsulation adhesive layer and a fog light layer; the fog light layer includes a resin adhesive...
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Main Author | |
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Format | Patent |
Language | English |
Published |
10.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides an LED encapsulation structure. The LED encapsulation structure includes a silicon carbide heat dissipation substrate, an LED light-emitting chip, a fluorescent material-doped encapsulation adhesive layer and a fog light layer; the fog light layer includes a resin adhesive and a plurality of semitransparent microspheres which are dispersed in the resin adhesive and are distributed in a single-layer and flat manner; and one side of each semitransparent microsphere, which is adjacent to a light extracting side, is removed partially, so that hemispherical concave surfaces can be formed. With the LED encapsulation structure adopted, light can be soft and can have circle-shaped bright spots. The LED encapsulation structure of the utility model is suitable for indoor decorative illumination. |
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Bibliography: | Application Number: CN20142677768U |