LED encapsulation structure

The utility model provides an LED encapsulation structure. The LED encapsulation structure includes a silicon carbide heat dissipation substrate, an LED light-emitting chip, a fluorescent material-doped encapsulation adhesive layer and a fog light layer; the fog light layer includes a resin adhesive...

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Bibliographic Details
Main Author SI HONGKANG
Format Patent
LanguageEnglish
Published 10.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model provides an LED encapsulation structure. The LED encapsulation structure includes a silicon carbide heat dissipation substrate, an LED light-emitting chip, a fluorescent material-doped encapsulation adhesive layer and a fog light layer; the fog light layer includes a resin adhesive and a plurality of semitransparent microspheres which are dispersed in the resin adhesive and are distributed in a single-layer and flat manner; and one side of each semitransparent microsphere, which is adjacent to a light extracting side, is removed partially, so that hemispherical concave surfaces can be formed. With the LED encapsulation structure adopted, light can be soft and can have circle-shaped bright spots. The LED encapsulation structure of the utility model is suitable for indoor decorative illumination.
Bibliography:Application Number: CN20142677768U