Full-automatic mechanism for quantitative adhesive dispensing
The utility model relates to a full-automatic mechanism for quantitative adhesive dispensing. The full-automatic mechanism adopts the structure that an x-axis mechanism is mounted on a baseplate; a y-axis mechanism is mounted on the x-axis mechanism through an x-y axis connecting plate; a mounting p...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
20.05.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model relates to a full-automatic mechanism for quantitative adhesive dispensing. The full-automatic mechanism adopts the structure that an x-axis mechanism is mounted on a baseplate; a y-axis mechanism is mounted on the x-axis mechanism through an x-y axis connecting plate; a mounting plate is mounted on the y-axis mechanism; two z-axis mounting connecting plates are respectively mounted on two sides of the mounting plate; a z-axis mounting plate is mounted on the z-axis mounting connecting plates; the z-axis mechanism is mounted on the z-axis mounting plate; an adhesive dispensing mechanism is mounted on the z-axis mechanism; an adhesive dispensing pressure mechanism is mounted on the mounting plate, and positioned on the back side of the mounting plate; a CCD mechanism is mounted on the z-axis mounting plate; a laser mechanism is mounted on a CCD mounting plate in the CCD mechanism; the x-axis, y-axis and z-axis mechanisms are used for transferring the adhesive dispensing mechanism to standard operating positions; the adhesive dispensing pressure mechanism is used for regulating adhesive dispensing pressure, so as to ensure that an appropriate amount of adhesive can be dispensed; the CCD mechanism is used for calibrating the adhesive dispensing positions; the laser mechanism is used for acquiring volume information of the adhesive, so as to calculate the actual amount of the adhesive. Through the adoption of the full-automatic mechanism, the adhesive dispensing positions and the actual amount of the adhesive can be precisely controlled, so that the adhesive dispensing process can be more precise. |
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Bibliography: | Application Number: CN20142697651U |