Packaging fixing plate for wafer UV (ultraviolet) film materials for high-density semiconductor encapsulation

The utility model discloses a packaging fixing plate for wafer UV (ultraviolet) film materials for high-density semiconductor encapsulation. The packaging fixing plate comprises a baffle plate and a fixing round tube, wherein the baffle plate consists of an upper plate and a lower plate, two install...

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Bibliographic Details
Main Authors CUI QINGLONG, SUN ZHIHUAI, CHEN TIANAN
Format Patent
LanguageEnglish
Published 22.04.2015
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
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Summary:The utility model discloses a packaging fixing plate for wafer UV (ultraviolet) film materials for high-density semiconductor encapsulation. The packaging fixing plate comprises a baffle plate and a fixing round tube, wherein the baffle plate consists of an upper plate and a lower plate, two installing holes are formed in the baffle plate in a halving and centering way, and the fixing round tube is movably arranged on the baffle plate through the installing holes from the outer side of the baffle plate to the inner side. The a packaging fixing plate for the wafer UV film materials for high-density semiconductor encapsulation has the advantages that the structure is simple, green and environment-friendly effects are achieved, and the use is convenient.
Bibliography:Application Number: CN20142697822U