COB packaged LED (light-emitting diode) device

The utility model relates to a COB packaged LED (light-emitting diode) device, which comprises a substrate and more than two chips arranged on the substrate, wherein the surface of each chip is provided with a fluorescent layer. A lens is arranged above the more than two chips and comprises more tha...

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Bibliographic Details
Main Authors TAN CHENXI, TONG GENSHENG, YU DONG
Format Patent
LanguageEnglish
Published 25.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model relates to a COB packaged LED (light-emitting diode) device, which comprises a substrate and more than two chips arranged on the substrate, wherein the surface of each chip is provided with a fluorescent layer. A lens is arranged above the more than two chips and comprises more than two lens units, wherein the more than two lens units are adjacently arranged, and each lens unit comprises a first circular arc surface, a second circular arc surface and a plane connecting the first circular arc surface and the second circular arc surface. The COB packaged LED device can realize approximate Lambertian distribution and uniform illumination of specific light, avoids occurrence of total reflection of light at an interface between fluorescent glue or silica gel and the air, and improves light extraction of the device. Meanwhile, a point light effect does not emerge in far-field observation through light field superposition of the numerous lens units; and heat generated by the fluorescent glue in operation can be transmitted to the substrate quickly through the chips so as to carry out heat dissipation, thereby avoiding influences imposed on physical characteristics of the fluorescent glue and the silica gel by temperature rise in the glue.
Bibliography:Application Number: CN20142635276U