Water cooling plate with flow-disturbing staggered steps in clip-shaped channels
The utility model provides a water cooling plate with flow-disturbing staggered steps in clip-shaped channels. The water cooling plate comprises an upper cover plate, a substrate and a lower cover plate. Clip-shaped channels are arranged on surfaces of both the upper cover plate and the substrate th...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
18.02.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides a water cooling plate with flow-disturbing staggered steps in clip-shaped channels. The water cooling plate comprises an upper cover plate, a substrate and a lower cover plate. Clip-shaped channels are arranged on surfaces of both the upper cover plate and the substrate through milling, and flow-disturbing steps are designed in the clip-shaped channels. The flow-disturbing steps in the clip-shaped channels of the upper cover plate and the flow-disturbing steps in the clip-shaped channels of the substrate are arranged in a staggered manner. The upper cover plate, the lower cover plate and the substrate are welded together to form the water cooling plate having a water inlet and a water outlet. The flow-disturbing steps in the clip-shaped channels of the upper cover plate and the flow-disturbing steps in the clip-shaped channels of the substrate of the water cooling plate are designed in a staggered manner, thereby effectively reducing the thickness of a liquid film on a thermal boundary layer, reducing the thermal resistance of fluids during convection heat exchange, and making the fluids in the channels changed to be in a violent, disordered and turbulent flowing state. Therefore, heat exchange effects are improved, the heat transfer performance of the water cooling plate is improved, and the thermal resistance of the water cooling plate is reduced. The heat dissipation difficulty of electronic equipment ranging from 13W/cm to 15W/cm in heat flux is solved. When a rated rate of flow is 6L/min, the thermal resistance of the water cooling plate can reach below 8K/kw. |
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Bibliography: | Application Number: CN20142660641U |