Swirl electrodeposition device

The utility model discloses a swirl electrodeposition device which is characterized in that a guide cylinder is concentrically connected between an electrodeposition cylinder and an electrodeposited liquid inlet pipe, and a plurality of guide vanes are uniformly and fixedly arranged around the circu...

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Bibliographic Details
Main Authors TIAN XINGTANG, CHEN YONGFENG, CAO QUANHONG, SUN WEI, GUO ZHIWEN, LIU YUE, WANG XIANGYANG
Format Patent
LanguageEnglish
Published 28.01.2015
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Summary:The utility model discloses a swirl electrodeposition device which is characterized in that a guide cylinder is concentrically connected between an electrodeposition cylinder and an electrodeposited liquid inlet pipe, and a plurality of guide vanes are uniformly and fixedly arranged around the circumference of the inner wall of the guide cylinder and are spirally arranged; and a hollow anode tube is also concentrically penetrated in the electrodeposition cylinder, the lower end of the anode tube extends to the bottom of the guide cylinder, the inner side of each guide vane is fixedly arranged on the outer wall of the lower end of the anode tube, a plurality of through holes are formed in the wall of the anode tube located above the guide cylinder, and all the through holes are formed along the tangential direction of the anode tube and face to the rotating direction of electrodeposited liquid. According to the swirl electrodeposition device disclosed by the utility model, due to the arrangement of the electrodeposition cylinder, the electrodeposited liquid can rotate at a high speed in the electrodeposition cylinder, so that the aim of reducing concentration polarization is achieved. Meanwhile, part of electrodeposited liquid is tangentially sprayed out from the through holes formed in the wall of the anode tube after passing through the hollow anode tube, so that the process that the electrodeposited liquid is mixed near a cathode is enhanced, and the influences of concentration polarization to metal electrodeposition can be further reduced.
Bibliography:Application Number: CN20142533471U