LED packaging structure

The utility model discloses an LED packaging structure, comprising an LED support and LED chips. The LED support comprises a housing and metal pins connected to the housing; the housing is provided with a bowl-shaped core space; the LED chips are arranged on the bottom of the bowl-shaped core space;...

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Bibliographic Details
Main Authors ZOU QIBING, LUO XINFANG
Format Patent
LanguageEnglish
Published 21.01.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses an LED packaging structure, comprising an LED support and LED chips. The LED support comprises a housing and metal pins connected to the housing; the housing is provided with a bowl-shaped core space; the LED chips are arranged on the bottom of the bowl-shaped core space; the LED chips are in electric connection with the metal pins; the inner and periphery of the bowl-shaped core space of the housing are both covered by epoxy molding compounds (EMCs); the metal pins are bended to be in contact with the EMC on the periphery of the housing. The LED packaging structure can be flexibly improved to obtain different structures and sizes, improve the cases of electric leakage and dead light, and have good product consistency.
Bibliography:Application Number: CN20142473014U