Packaging structure of LED lamp beads

• Main Author: TONG JUNLIANG
• Format: Patent
• Language: English
• Published: 21.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a packaging structure of LED lamp beads. The packaging structure comprises an IR infrared photosensitive tube chip, the LED lamp beads, and a heat radiation substrate, the IR infrared photosensitive tube chip can employ the infrared technology to realize short-distance data communication and the reception function of information forwarding, the LED lamp beads can convert electricity to light and have a data information carrier transmitting function, and the heat radiation substrate is used for absorbing heat generated by the chip, conducting the heat to a heat sink, and realizing heat exchange with the outside. According to the packaging structure, LED illumination chips cooperate with the IR infrared photosensitive tube chip, the data sending function in data transmission of general information can be realized via the LED illumination chips in an illuminating lamp, then the information is decoded via the IR infrared photosensitive tube chip, the packaging structure of the LED lamp beads is additionally provided with an optical communication transmission function based on the single function, the aluminum substrate is provided so that the problem of heat radiation of the LED lamp beads is effectively solved, the production cost is low, the light-emitting efficiency is high, and the packaging structure is applicable to large-scale promotion.