Dust prevention and heat dissipation device of computer mainboard
The utility model discloses a dust prevention and heat dissipation device of a computer mainboard. The dust prevention and heat dissipation device of the computer mainboard comprises a bottom cover board, an upper cover board, two sets of heat dissipation sieves, a pair of connection spring columns,...
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Main Author | |
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Format | Patent |
Language | English |
Published |
07.01.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a dust prevention and heat dissipation device of a computer mainboard. The dust prevention and heat dissipation device of the computer mainboard comprises a bottom cover board, an upper cover board, two sets of heat dissipation sieves, a pair of connection spring columns, a plurality of fasteners, the computer mainboard and two non-slip mats; the bottom cover board is provided with a lower clamping groove, the upper cover board is provided with an upper clamping groove, and the two non-slip mats are laid in the lower clamping groove and the upper clamping groove respectively; the fasteners are arranged in the lower clamping groove and the upper clamping groove, the computer mainboard is clamped in the upper clamping groove and the lower clamping groove, and the bottom cover board and the upper cover board are provided with a plurality of heat dissipation through grooves; the connection spring columns are arranged between the two sets of heat dissipation sieves connected with the bottom cover board and the upper cover board; each heat dissipation sieve is formed by arranging a plurality of cylindrical sieve bodies side by side at intervals; the outer surfaces of the heat dissipation sieves are provided with spiral grooves, and multiple dust collection blocks are arranged on the two sides of the cylindrical sieve bodies. The computer mainboard is fixedly installed in a computer case, the good heat dissipation effect is achieved, the chance that dust is adsorbed on the computer mainboard is reduced, and the service life of the computer mainboard is prolonged. |
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Bibliography: | Application Number: CN20142628965U |