Bending-resistant gold finger based on double-sided flexible circuit board

The utility model discloses a bending-resistant gold finger based on a double-sided flexible circuit board. The bending-resistant gold finger comprises copper foil layers, a base material layer and pure glue layers which are used for adhering the copper foil layers and the base material layer. The c...

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Bibliographic Details
Main Author PENG YINGHUA
Format Patent
LanguageChinese
English
Published 17.12.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a bending-resistant gold finger based on a double-sided flexible circuit board. The bending-resistant gold finger comprises copper foil layers, a base material layer and pure glue layers which are used for adhering the copper foil layers and the base material layer. The copper foil layers comprise a first copper foil layer which is fit with the front surface of the base material layer in a pressing way and a second copper foil layer which is fit with the reverse surface of the base material layer in the pressing way. The pure glue layers comprise a first pure glue layer which adheres the reverse surface of the first copper foil layer and the front surface of the base material layer and a second pure glue layer which adheres the front surface of the second copper foil layer and the reverse surface of the base material layer. The partial area exactly opposite to the reverse surface of the base material layer has no arrangement of the second copper foil layer so that a no copper area
Bibliography:Application Number: CN20142380452U