Shared electrode of crimping type insulating electric power semiconductor module
Provided is a shared electrode of a crimping type insulating electric power semiconductor module. The shared electrode is provided with upper and lower folding parts. Gaps for preventing extrusion parts forming on the shared electrode during a folding moulding process are correspondingly arranged on...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
03.12.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a shared electrode of a crimping type insulating electric power semiconductor module. The shared electrode is provided with upper and lower folding parts. Gaps for preventing extrusion parts forming on the shared electrode during a folding moulding process are correspondingly arranged on two ends of the lower folding part. A groove for preventing connecting the gaps and preventing a protruding part forming on the shared electrode during the folding moulding process is arranged in the outer wall of the lower folding part. Gaps for preventing extrusion parts forming on the shared electrode during a folding moulding process are correspondingly arranged on two ends of the upper folding part. A groove for preventing connecting the gaps and preventing a protruding part forming on the shared electrode during the folding moulding process is arranged in the outer wall of the upper folding part. According to the utility model, the four gaps are arranged in two sides of the bent places, and the two grooves a |
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Bibliography: | Application Number: CN201420389278U |