Diamond composite cutting pick

The utility model relates to a diamond composite cutting pick. The cutting pick is characterized by comprising a hard alloy matrix and a diamond layer, wherein the hard alloy matrix comprises a cone part and a butted spherical segment part; the combination surface of the hard alloy matrix and the di...

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Bibliographic Details
Main Authors ZHANG TAO, DOU MING, LU CANHUA, LIU JUNTAO, NING JUNLEI
Format Patent
LanguageChinese
English
Published 26.11.2014
Subjects
EARTH DRILLING
FIXED CONSTRUCTIONS
MINING
MINING OR QUARRYING
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Summary:The utility model relates to a diamond composite cutting pick. The cutting pick is characterized by comprising a hard alloy matrix and a diamond layer, wherein the hard alloy matrix comprises a cone part and a butted spherical segment part; the combination surface of the hard alloy matrix and the diamond layer is formed by a conical surface and a spherical surface which are consubstantial and coaxial with the combination surface; uniformly-distributed radial or rectangular grooves and circumferential ring grooves are arranged in the conical surface; and circumferential ring grooves and radial grooves are arranged in the spherical surface. By means of the diamond composite cutting pick disclosed by the utility model, the impact resistance and the wear resistance of polycrystalline diamond composite cutting picks are further increased.
Bibliography:Application Number: CN20142348207U