Heat-conducting seat with modified density, and heat dissipation module thereof

The utility model provides a heat-conducting seat with modified density, and a heat dissipation module thereof. An activation metal layer is formed on any surface of the heat-conducting seat or the heat dissipation module, the activation metal layer and the heat-conducting seat are made of the same...

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Bibliographic Details
Main Author XIE YIREN
Format Patent
LanguageEnglish
Published 08.10.2014
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The utility model provides a heat-conducting seat with modified density, and a heat dissipation module thereof. An activation metal layer is formed on any surface of the heat-conducting seat or the heat dissipation module, the activation metal layer and the heat-conducting seat are made of the same material, and the density of the activation metal layer is greater than the density of the heat-conducting seat. According to the utility model, the density is high, the thermal conduction efficiency of a material itself is improved, and the heat dissipation effect is enhanced.
Bibliography:Application Number: CN20142245334U