Multi-chip no-lead assembly

• Main Authors: STEVEN SAPP, SUNGGEUN YOON, CHUNG-LIN WU, BIGILDIS DOSDOS, SURESH BELANI
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The application relates to a multi-chip no-lead assembly, and the assembly comprises: an integrated circuit with a plurality of electrodes; a double-channel MOSFET which is provided with a first source electrode, a second source electrode, a first grid electrode, a second grid electrode, and a common drain electrode; a lead frame which is provided with a plurality of leads, wherein each lead is provided with an exposed contact surface on the outer bottom surface of the assembly, and is used for transmitting electric power to the integrated circuit and the double-channel MOSFET, or transmitting an electric signal to/from the integrated circuit and the double-channel MOSFET; and sealing insulating resin which enables the lead frame, the integrated circuit and the double-channel MOSFET to be embedded into the assembly, and the exposed contact surfaces of the leads are limited on the outer surface of the assembly. The first lead and the second lead are respectively connected to the first and second electrodes of