LED device having transition substrate

• Main Authors: LI ZONGTAO, LI HONGHAO, GUAN WOHUAN, DING XINRUI
• Format: Patent
• Language: Chinese; English
• Published: 09.04.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses an LED device having a transition substrate, and the LED device comprises at least an LED unit, a metal substrate and packaging glue. The LED unit comprises an LED chip and the transition substrate, an expansion coefficient of the transition substrate is between an expansion coefficient of the LED chip and an expansion coefficient of the metal substrate, and the difference between the expansion coefficient of the LED chip and the expansion coefficient of the transition substrate is 0-20% of the expansion coefficient of the LED chip. The LED chip is the flip chip, and a positive electrode and a negative electrode are arranged at the bottom of the LED chip. At least two mutually insulated welding layers are arranged on the upper surface of the transition substrate, at least two mutually insulated paster pins are arranged on the lower surface of the transition substrate, and the at least two welding layers are electrically connected with the two paster pins. The positive electrode and