Multi-layer insulating metal-based circuit board
The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a first insulating layer is arranged between two adjacent metal substrates. Furthermore a second insulating layer is arranged on the external...
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
26.02.2014
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a first insulating layer is arranged between two adjacent metal substrates. Furthermore a second insulating layer is arranged on the external surface of each of the two metal substrates at outmost side. The external surfaces of the two second insulating layers are respectively provided with a copper foil circuit layer. The thickness of an aluminum substrate is reduced through adding resin insulating layers, thereby causing an excellent heat conduction performance of the circuit board, greatly reducing production cost and facilitating production. |
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| AbstractList | The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a first insulating layer is arranged between two adjacent metal substrates. Furthermore a second insulating layer is arranged on the external surface of each of the two metal substrates at outmost side. The external surfaces of the two second insulating layers are respectively provided with a copper foil circuit layer. The thickness of an aluminum substrate is reduced through adding resin insulating layers, thereby causing an excellent heat conduction performance of the circuit board, greatly reducing production cost and facilitating production. |
| Author | CAO QINGRONG ZHANG ZHONG TANG XUEMING |
| Author_xml | – fullname: TANG XUEMING – fullname: CAO QINGRONG – fullname: ZHANG ZHONG |
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| Notes | Application Number: CN20132522694U |
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| PublicationDate | 20140226 |
| PublicationDateYYYYMMDD | 2014-02-26 |
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| PublicationYear | 2014 |
| RelatedCompanies | KUNSHAN HUASHENG PRINTED CIRCUIT BOARD CO., LTD |
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| Snippet | The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Multi-layer insulating metal-based circuit board |
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