Multi-layer insulating metal-based circuit board

The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a first insulating layer is arranged between two adjacent metal substrates. Furthermore a second insulating layer is arranged on the external...

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Bibliographic Details
Main Authors TANG XUEMING, CAO QINGRONG, ZHANG ZHONG
Format Patent
LanguageChinese
English
Published 26.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a multi-layer insulating metal-based circuit board which comprises a plurality of successively stacked metal substrates, wherein, a first insulating layer is arranged between two adjacent metal substrates. Furthermore a second insulating layer is arranged on the external surface of each of the two metal substrates at outmost side. The external surfaces of the two second insulating layers are respectively provided with a copper foil circuit layer. The thickness of an aluminum substrate is reduced through adding resin insulating layers, thereby causing an excellent heat conduction performance of the circuit board, greatly reducing production cost and facilitating production.
Bibliography:Application Number: CN20132522694U