Heat-dissipating type high-power LED energy-saving lamp cup with sound controller and temperature controller

• Main Author: YANG WENHAI
• Format: Patent
• Language: Chinese; English
• Published: 25.09.2013
• Subjects: BLASTING; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; HUMAN NECESSITIES; HYGIENE; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES; MECHANICAL ENGINEERING; MEDICAL OR VETERINARY SCIENCE; METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL; NON-PORTABLE LIGHTING DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

The utility model discloses a heat-dissipating type high-power LED energy-saving lamp cup with a sound controller and a temperature controller. The heat-dissipating type high-power LED energy-saving lamp cup with the sound controller and the temperature controller comprises a cup body and a lamp holder. The rear end of the cup body is connected with the lamp holder. The heat-dissipating type high-power LED energy-saving lamp cup with the sound controller and the temperature controller is characterized in that an aluminum lamp board is arranged on the inner bottom face of the cup body, a PCB and a plurality of reflecting lenses are arranged on the aluminum lamp board, an LED lamp is installed on each reflecting lens, the aluminum lamp board is connected with one end of a heat pipe, the other end of the heat pipe is connected to the lamp holder, and heat dissipating fins are installed on the heat pipe; the temperature controller is arranged on the aluminum lamp board, an LED driving chip is arranged on the PCB,