Package structure of LED light source

The utility model discloses a package structure of an LED light source. LED wafers are fixed on a front face of a transparent sheet-shaped die bond substrate through a transparent adhesive. The positive electrode and the negative electrode of each LED wafer are respectively directly or indirectly el...

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Bibliographic Details
Main Authors MA HONGYI, JIANG CHUNMIN
Format Patent
LanguageChinese
English
Published 18.09.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a package structure of an LED light source. LED wafers are fixed on a front face of a transparent sheet-shaped die bond substrate through a transparent adhesive. The positive electrode and the negative electrode of each LED wafer are respectively directly or indirectly electrically connected with the positive electrode circuit or the negative electrode circuit of the die bond substrate in correspondence through bonding leads. The positive electrode circuit and the negative electrode circuit are respectively in corresponding electrical connection with the positive electrode outer pin and the negative electrode outer pin which are disposed on the die bond substrate. Phosphor powder is filled onto the front face and the back face of the die bond substrate through a transparent AB adhesive, so that the phosphor powder filled on the front face wraps the LED chips. The package structure changes a conventional method of die bonding: through the method of fixing the wafers on the transpare
Bibliography:Application Number: CN2013269140U