Postforming pressure-equalizing body of complex conductive structure
The utility model relates to a postforming pressure-equalizing body of a complex conductive structure. The postforming pressure-equalizing body of the complex conductive structure comprises cover bodies cured by a foaming agent, conductive layers coated on the outer surface of the cover bodies, elec...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
18.09.2013
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model relates to a postforming pressure-equalizing body of a complex conductive structure. The postforming pressure-equalizing body of the complex conductive structure comprises cover bodies cured by a foaming agent, conductive layers coated on the outer surface of the cover bodies, electrodes, silicon stacks, capacitors and thin metal sheets, wherein the conductive layers are connected with the electrodes, the silicon stacks and tip nodes of the capacitors, and the thin metal sheets are connected between the electrodes and the conductive layers. The postforming pressure-equalizing body of the complex conductive structure is formed through the above manner. With the postforming pressure-equalizing body of the complex conductive structure adopted, corona which is generated between air and silicon stacks and exposed tip nodes of capacitors in a voltage-multiplying assembly can be eliminated or decreased, and the requirement for partial discharge can be satisfied, and at the same time, the testing pe |
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Bibliography: | Application Number: CN20122517943U |