Gas release device for film coating process

• Main Authors: MENG LIANG, CHEN GUANBI, CHEN JUNJIAN, LAI WENBO, LI SHENG, HUANG SHIREN, ZENG ZHAOLONG, LIAO KEFENG
• Format: Patent
• Language: Chinese; English
• Published: 11.09.2013
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model relates to a gas release device for a film coating process. The device comprises two plates butted with each other, wherein each plate is provided with a gas inlet groove; a gas inlet is formed in the top end of the gas inlet groove, and the bottom end of each gas inlet groove is connected with a first distribution groove; each of the two ends of the first distribution groove is respectively connected with a second distribution groove; each of the two ends of each second distribution groove is respectively connected with a third distribution groove; each of the two ends of each third distribution groove is respectively connected with a fourth distribution groove; each of the two ends of each fourth distribution groove is respectively connected with a fifth distribution groove; and the bottom end of each fifth distribution groove is provided with an exhaust port. Thus, gas of an evaporation source enters the gas inlet grooves, and then successively passes through all the distribution grooves,