High strength heat insulation phenolic epoxy resin composition board

• Main Authors: REN CAIWEI, HE XINGWANG, YANG GUOHONG, YE WENBO, LIU CHONG, CAO YUAN, HU LANQING, MA JING, LIANG SHIJUN
• Format: Patent
• Language: Chinese; English
• Published: 21.08.2013
• Subjects: BLASTING; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; JOINTS OR FITTINGS FOR PIPES; LIGHTING; MEANS FOR THERMAL INSULATION IN GENERAL; MECHANICAL ENGINEERING; PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; THERMAL INSULATION IN GENERAL; WEAPONS

The utility model discloses a high strength heat insulation phenolic epoxy resin composition board, which solves the problems that a heat insulation pad which is matched with a pipeline steel baffle plate in a heat transfer pipeline support seat has low compressive and tensile strength and is easy to form a heat bridge phenomenon. The high strength heat insulation phenolic epoxy resin composition board comprises a high strength heat insulation phenolic epoxy resin board and a steep board, wherein 2m SiO2-Al3O3 ceramic coating (2) is sprayed on the surface of the steel board (1), and the high strength heat insulation phenolic epoxy resin board (3) and the steel board with the SiO2-Al3O3 ceramic coating (2) are bonded together through high temperature adhesive-glue which resists 500 DEG C. The high strength heat insulation phenolic epoxy resin composition board is applied on a fixed baffle plate of a heat transfer pipeline, can effectively prevent generating a heat bridge phenomenon in the heat transfer pipelin