Heating and cooling structure for integrated circuit test

The utility model discloses a heating and cooling structure for an integrated circuit test. The structure comprises a high and low-temperature drying air source box, an air supply pipeline, air return pipelines, an IC (Integrated Circuit) insulating cavity, an IC guide rail, a temperature controller...

Full description

Saved in:
Bibliographic Details
Main Author LIANG DAMING
Format Patent
LanguageChinese
English
Published 17.07.2013
Subjects
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The utility model discloses a heating and cooling structure for an integrated circuit test. The structure comprises a high and low-temperature drying air source box, an air supply pipeline, air return pipelines, an IC (Integrated Circuit) insulating cavity, an IC guide rail, a temperature controller and the like. The high and low-temperature drying air source box is respectively connected to the air supply pipeline and the air return pipelines. The air supply pipeline and the air return pipelines are connected with the IC insulating cavity. The high and low-temperature drying air source box generates high temperature air or low temperature air through an alternating current and a compressor. The temperature can be adjusted and set. The highest temperature is +200 DEG C for normal test, while the lowest temperature is -80 DEG C for normal test. The IC insulating cavity comprises a cavity bottom and a cavity lid. The whole cavity is formed by sealing a high and low temperature resisting material, and has an abs
Bibliography:Application Number: CN20122684549U