Radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding

• Main Authors: WEI TIANDE, SUN HONGYE
• Format: Patent
• Language: Chinese; English
• Published: 05.12.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a radio frequency power amplifier installation apparatus capable of achieving heat dissipation and grounding. The apparatus comprises a heat dissipation pedestal, a PCB board and a U-shaped fixed seat, wherein the PCB board is tightly arranged on an upper surface layer of the heat dissipation pedestal and the PCB board is provided with mesopore where the radio frequency power amplifier is placed; a shape of the mesopore is matched with a packaging outline structure of the radio frequency power amplifier; a pair of input and output pin pads and a pair of grounding pads are arranged along a surrounding edge of the mesopore; the U-shaped fixed seat comprises a U-shaped seat body located on a central section; upper two sides of the U-shaped seat body are provided with end ears; an inner groove of the U-shaped seat body provides a fixed position for the power amplifier; the end ears on the two sides are provided with fixed holes. Connection of the U-shaped fixed seat, the PCB board and