Bonding device for laser head P cover and yoke plate

The utility model discloses a bonding device for a laser head P cover and a yoke plate. The bonding device comprises a base, and a P cover transloading assembly, a yoke plate UV (Ultraviolet) glue dripping assembly, a UV hardening assembly and a yoke plate glue dripping assembly which are arranged o...

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Bibliographic Details
Main Authors CHEN FANGCHUN, YANG WUGUI, CUN LIHONG
Format Patent
LanguageChinese
English
Published 19.09.2012
Subjects
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Summary:The utility model discloses a bonding device for a laser head P cover and a yoke plate. The bonding device comprises a base, and a P cover transloading assembly, a yoke plate UV (Ultraviolet) glue dripping assembly, a UV hardening assembly and a yoke plate glue dripping assembly which are arranged on the base, wherein the P cover transloading assembly is a P cover loading clamp; the loading clamp is arranged on a linear slide rail; the base is provided with a linear cylinder for driving the loading clamp to move along the linear slide rail; the linear cylinder is provided with a first position which is convenient for coating yoke plate UV glue on the linear slide rail, and a second position which is convenient for hardening yoke plate UV glue and dripping glue onto a P cover; the first position and the second position are positioned at the two ends of the linear slide rail; the yoke plate UV glue dripping assembly is close to the first position; and the UV hardening assembly and the P cover glue dripping asse
Bibliography:Application Number: CN2012264044U