Heat pipe type heat dissipation platform for comprehensive aging system of high power transistor

The utility model discloses a heat pipe type heat dissipation platform for a comprehensive aging system of a high power transistor. At least two heat pipes are arranged in a baseboard along the longitudinal direction and stretch out of one end or two ends of the baseboard simultaneously, a plurality...

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Bibliographic Details
Main Author XIE RUISHENG
Format Patent
LanguageChinese
English
Published 29.08.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a heat pipe type heat dissipation platform for a comprehensive aging system of a high power transistor. At least two heat pipes are arranged in a baseboard along the longitudinal direction and stretch out of one end or two ends of the baseboard simultaneously, a plurality of fins are sleeved on the heat pipes stretching out of the baseboard, a plurality of component jacks are arranged on the baseboard, corresponding bolt holes are arranged on two sides of the component jacks respectively, press block components are arranged on the bolt holes, connecting holes are arranged at four corners of the baseboard, and heating components and corresponding mounting holes are arranged on two horizontal end surfaces of the baseboard. The heat pipe type heat dissipation platform for the comprehensive aging system of the high power transistor has a simple structure and is maintenance-free; efficient heat transfer technology of the heat pipes is used, reliable heat dissipation of the F2 type compo
Bibliography:Application Number: CN20112565396U