Heat dissipation device of large power light-emitting diode (LED) module

• Main Authors: GUO MINYING, LIU SHENGYIN, CHEN LINA
• Format: Patent
• Language: Chinese; English
• Published: 02.11.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a heat dissipation device of a large power light-emitting diode (LED) module, which comprises a long strip-shaped groove holder. The section of the groove holder is in a semicircle shape, board-shaped base boards are installed on two lateral sides of the groove holder in match mode, a heat dissipation layer and a heat conduction layer closely attached to the heat dissipation layer are arranged on an arc surface of the strip-shaped groove holder from the outside to the inside in layering mode, heat dissipation fins and circular holes are arranged on the outer wall of the heat dissipation layer, and the heat dissipation fins and the circular holes bring convenience to heat dissipation. When in use, LED pasters are closely attached to the base board, heat dissipated by the LED pasters can be transmitted to the heat dissipation layer through the heat conduction layer, and then the heat dissipation layer dissipates the heat into air, thereby realizing a purpose of reducing the temperat