Heat conducting device

The utility model relates to a heat conducting device, which is provided with a cavity comprising an upper plate and a lower plate, wherein the cavity is filled with working fluid; a support column and a sheet solder for welding the upper plate and the lower plate are arranged between the upper plat...

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Bibliographic Details
Main Authors KE LIE, ZHANG ZHENGGUO
Format Patent
LanguageChinese
English
Published 02.11.2011
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:The utility model relates to a heat conducting device, which is provided with a cavity comprising an upper plate and a lower plate, wherein the cavity is filled with working fluid; a support column and a sheet solder for welding the upper plate and the lower plate are arranged between the upper plate and the lower plate; a sintering layer formed by sintering metal powder is attached to the inner surface of the lower plate; and a plurality of cylindrical sintering bodies contacted with the inner surface of the upper plate are formed on the surface of the sintering layer. According to the heat conducting device, the cylindrical sintering bodies contacted with the upper plate are formed on the surface of the sintering layer, the absorption of the working fluid condensed on the inner surface of the upper plate is enhanced by using capillary structures in the sintering bodies and the working fluid quickly reflows to the sintering layer and the concave part of the lower plate; and a traditional reflow mode of reflo
Bibliography:Application Number: CN20112105523U