Lead frame

The utility model discloses a lead frame which comprises a lead frame body, wherein the lead frame body consists of at least one unit, a wafer carrying table is arranged on each lead frame body unit, a pin is matched with each wafer carrying table, a welding part is arranged at one end of each pin,...

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Bibliographic Details
Main Authors HAN BUJUN, HUANG YANGDONG, DING YING, SHEN JUN
Format Patent
LanguageChinese
English
Published 20.07.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a lead frame which comprises a lead frame body, wherein the lead frame body consists of at least one unit, a wafer carrying table is arranged on each lead frame body unit, a pin is matched with each wafer carrying table, a welding part is arranged at one end of each pin, and the connection between the pin and the wafer carrying table and the connection between the pin and adjacent units are achieved through connection structures. The lead frame is characterized in that a through-hole is formed on each welding part. As the through-hole is formed on the welding part of the pin of the lead frame, the packaging resin and the pin are completely bonded, the existence of air between the packaging resin and the pin is prevented, the bonding strength between the packaging resin and the pin is enhanced and the package quality of the semiconductor elements is ensured.
Bibliography:Application Number: CN20102674719U