Back board structure of solar panel module

The utility model relates to a back board structure of a solar panel module, which comprises an electric insulating layer and a sealing material layer which is directly formed on the electric insulating layer by the aid of a hot melt extrusion mode. Further, the upper surface of the sealing material...

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Bibliographic Details
Main Author YAO SHUHUI
Format Patent
LanguageChinese
English
Published 23.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Summary:The utility model relates to a back board structure of a solar panel module, which comprises an electric insulating layer and a sealing material layer which is directly formed on the electric insulating layer by the aid of a hot melt extrusion mode. Further, the upper surface of the sealing material layer is provided with a surface embossed structure.
Bibliography:Application Number: CN20102260132U